Microsoft is expected to reveal a new version of its HoloLens headset at Mobile World Congress later this month. The company has an event scheduled for February 24, and that date is being promoted in the rather mysterious video published by HoloLens’ creator Alex Kipman.
The planned 2019 release of the next-generation headset was leaked last year. Codenamed Sydney, the new model is expected to be lighter, more comfortable, and sport a better display. The sensors are updated (likely to something close to the Project Kinect for Azure standalone sensor), and Microsoft has confirmed that it will include an updated Holographic Processing Unit (HPU) with AI acceleration capabilities. The processor is believed to be a Qualcomm Snapdragon 850, replacing the Intel Atom of the first-generation unit.
This comes as Microsoft has sold out of original HoloLens units. Neither the developer kit nor the commercial version is available to buy.
Listing image by Microsoft